Is 3D TSV only a solution for high end devices? TSV could penetrate the market for devices in high-end graphics, high-performance computing, networking and data centers. However It is also a key enabler for heterogeneous integration in segment such as MEMS & sensors, LED, RF components. What will be the future of this technology?
Yole Développement proposes to share its analysis of the situation on the 16th of January with a dedicated webcast.
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